师资队伍

苏晋荣

博士研究生 ,副教授,硕士生导师

邮箱:sujinrong@sxu.edu.cn

研究方向:微波无源器件设计

个人简介

苏晋荣,博士,副教授,硕士生导师,山西省通信学会理事。2017年获山西大学无线电物理博士学位,同年留校工作。主要从事微波无源器件方面的研究工作。主持省教育厅项目2项,企业委托横向项目一项,参与省级及国家自然科学基金项目3项。在国内外重要期刊上发表学术论文十余篇,其中SCI收录6篇,主要发表在IEEE ACCESS,IEEE transactions on Components, Packaging and Manufacturing Technology等期刊上。曾担任IEEE Microwave and Wireless Components Letters, International Journal of RF and Microwave Computer-Aided Engineering等期刊审稿人。

学术论文

[1] Jinrong Su, Yanling Li, Xinwei Chen, Guorui Han and Wenmei Zhang,A compact quasi-self-complementary UWB MIMO antenna decoupled by SRRs,International Journal of Microwave and Wireless Technologies,Sep. 2023, 15(7), 1251-1261
[2] Jinrong Su, Shiqi Di, Chunhui Yao, and Xinwei Chen, A Compact High-Isolation Tri-Band MIMO Antenna Based on Characteristic Mode Analysis, Progress in Electromagnetics Research M, Sep. 2024, vol.129, 1-10
[3] Jinrong Su, Haobo Wang, Haipeng Dou, and Xinwei Chen, Modeling of TSV-Based 3-D Heterogeneous Solenoid Inductor with High Inductance Value, Progress in Electromagnetics Research Letters, Oct. 2023, vol. 112, 111-118
[4] Jinrong Su, Wenmei Zhang, Chunhui Yao, Partial Coaxial Through-Silicon via for Suppressing the Substrate Noise in 3-Dimensional Integrated Circuit, IEEE Access, Jul. 2019, vol.7, 98803-98810
[5] Jinrong Su, Fang Wang, Wenmei Zhang, Capacitance Expressions and Electrical Characterization of Tapered Through-Silicon Vias for 3- Dimensional ICs, IEEE Trans. Components, Packaging and Manufacturing Technology, Oct. 2015, 5(10), 1488-1496.
[6] Jinrong Su, Runbo Ma, Xinwei Chen, Liping Han, Rongcao Yang, Wenmei Zhang, Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle, Microelectronics Journal, Dec. 2016, 58, 83–88.
[7] Jinrong Su, Xinwei Chen, Liping Han, Rongcao Yang, Wenmei Zhang, Study on Transmission Characteristics of Multi-walled Carbon Nanotube Based Through-Silicon Vias Considering Temperature Effects, IET. Microwave, Antenna and Propagation, Aug. 2017, 11(10), 1424-1431

科研项目

[1] 山西省高等学校科技创新项目,三维集成电路中环形硅通孔故障建模与定位研究,起止时间:2018.10-2020.9,批准号:127548901005,资助金额:2万。
[2] 山西省教育厅研究生教改项目,以岗位技术需求为导向的全日制工程硕士培养模式探索——以山西大学为例, 2018JG19,2018.5-2020.11,2万。
[3] 企业委托研究项目, 散装水泥罐车罐内水泥面高度检测系统设计,起止时间:2019.06-2022.06,批准号:01270119060028,资助金额:6万。
[4] 教育部产学研协同育人项目,5G无线通信基站安装与配置师资培训,2021.1-2023.9,资助金额:2万
[5] 山西省高等学校教学改革创新项目,“三全育人”理念下“电磁场与电磁波”教学模式探索与实践,2023.5-2025.5,J20230086,资助金额:1万

教材与专著

[1] 张志恒,逯暄,苏晋荣.电子技术基础,中国电力出版社,2021年。